With the explosion in artificial intelligence and high-performance computing demands, the computing power and energy density of data centers continue to break upper limits, pushing traditional air cooling technologies to their散热 limits. Market research indicates that liquid cooling technology, particularly cold plate solutions, is rapidly moving from pilot stages to commercial scale.
When single-cabinet power exceeds 20kW, liquid cooling becomes essential for ensuring stable computing operations due to its superior thermal conductivity. In this architecture, the reliability, efficiency, and corrosion resistance of heat exchange equipment responsible for dissipating chip heat to the outdoors directly impact the PUE and operational security of the entire data center.
Industry solution experts point out that plate heat exchangers, especially plate-and-shell heat exchangers, demonstrate unique advantages in isolating cooling tower circulating water from precision liquid cooling fluids due to their compact structure, high pressure resistance, and ease of maintenance. Additionally, in water-scarce regions, indirect evaporative cooling systems utilizing plate heat exchangers are favored for effectively preventing scaling and clogging
